Undergraduate Programme and Module Handbook 2013-2014 (archived)
Module ENGI4131: MICROELECTRONICS
Department: Engineering
ENGI4131:
MICROELECTRONICS
Type |
Tied |
Level |
4 |
Credits |
20 |
Availability |
Available in 2013/14 |
Module Cap |
None. |
Location |
Durham
|
Prerequisites
- Level 3 MEng Electronic Engineering
Corequisites
- As specified in programme regulations
Excluded Combination of Modules
- As specified in programme regulations
Aims
- This module is designed solely for
students studying School of Engineering and
Computing Sciences degree programmes.
- The module will provide graduates with
advanced knowledge and understanding of
Nanoelectronic and Photonic Devices, and CAD
for ICs and MEMs.
Content
- Top-down versus bottom-up
approaches to nanotechnology.
Nanoelectronics.
- Limitations of laws of physics
– thermodynamics and quantum
mechanics. Evolution of electronics. Moore’s
laws.
- Scaling laws for MOS
devices.
- Quantum limit. Power dissipation
limit. Material and device
limitations.
- Pattern
generation. Diffraction-limited
optics. Minimum feature size and depth of
focus.
- Phase shifting masks.Immersion
lithography. E-beam, ion-bean and X-ray
lithography.
- Microcontact
printing.
- Emerging devices. FinFET and UTB
devices. Coulomb blockade. Single electron
transistors.
- Use of organic materials in
electronics. Silicon versus polymers. Organic
diodes, transistors and
displays.
- Electronics at the molecular
level. Molecular diodes and
transistors.
- Molecular films: Self assembly
(chemical and electrostatic).
- LB film deposition.
- Photonic crystals: Fundamental
properties of photonic
crystals.
- Photonic devices:
Photoconduction and operation of semiconductor
photodiodes/lasers and solar
cells.
- Mixed Signal Integrated Circuit
applications for Audio and Video. Modelling of
electronic circuits using SPICE, and the types
of analysis available by simulation including
a Lab exercise. Development of a SPICE model
for a given circuit and simulation of the
circuit to investigate its
properties. Simulation will include "What If"
experiments to determine e.g. sensitivity to
component value.
- Integrated MEMS Applications:
for micro sensors and Transducers taking
account of the special mechanical design
considerations associated with MEMS devices
such as the accelerometer and Digital Mirror
Device. Development of a simulation based on
the modelling package COMSOL, and comparison
with real device data.
Learning Outcomes
- An awareness of the
state-of-the-art of microelectronic
devices.
- An understanding of the scope
for further developments and an
appreciation of the possible
exploitation of nanoelectronics and
photonics technologies (improved
materials, processing and
manipulation) for the realisation of
new device architectures.
- An awareness of current
technology and industrial practices
along with the ability to apply those
methods in novel situations.
- An in-depth knowledge and
understanding of specialised and
advanced technical and professional
skills, an ability to perform critical
assessment and review and an ability
to communicate the results of their
own work effectively.
- Capacity for independent
self-learning within the bounds of
professional practice.
- Highly specialised analysis
skills appropriate to an
engineer.
- Mathematics relevant to the
application of advanced engineering
concepts.
Modes of Teaching, Learning and Assessment and how these contribute to
the learning outcomes of the module
- The components for CAD for ICs and
MEMs are covered in lectures, practical
laboratories and are reinforced by direct
reading and problem solving activities
involving continuous assessment and laboratory
exercises. This course comprises two sections:
Mixed Signal Integrated Circuit applications
for Audio and Video, and Integrated MEMS
applications. Each component will be assessed
by continual assessment.
- The courses in Nanoelectronics and
Photonics are assessed by written timed
examinations.
- Students are able to make use of
staff 'Tutorial Hours' to discuss
any aspect of the module with teaching staff
on a one-to-one basis. These are sign up
sessions available for up to one hour per
week.
- Written timed examinations are
appropriate because of the wide range of
analytical, in-depth material covered in this
module and to demonstrate the ability to solve
advanced problems independently.
Teaching Methods and Learning Hours
Activity |
Number |
Frequency |
Duration |
Total/Hours |
|
CAD for ICs Workshop |
7 |
Typically 1 per week |
3 Hour |
21 |
■ |
CAD for MEMs Workshop |
6 |
Typically 1 per week |
3 Hour |
18 |
■ |
Nanoelectronics & Photonics Lectures |
20 |
Typically 1 per week |
1 Hour |
20 |
|
Tutorials Hours |
As required |
Weekly sign-up sessions |
up to 1 hour |
8 |
|
Preparation, Reading and
work on continual assessment outside
workshop sessions |
|
|
|
133 |
|
Total |
|
|
|
200 |
|
Summative Assessment
Component: Examination |
Component Weighting: 50% |
Element |
Length / duration |
Element Weighting |
Resit Opportunity |
Microelectronics
(Nanoelectronics & Photonics) |
2 hours |
100% |
No |
Component: Continuous Assessment |
Component Weighting: 50% |
Element |
Length / duration |
Element Weighting |
Resit Opportunity |
CAD for ICs |
|
50% |
No |
CAD for MEMS |
|
50% |
No |
None
■ Attendance at all activities marked with this symbol will be monitored. Students who fail to attend these activities, or to complete the summative or formative assessment specified above, will be subject to the procedures defined in the University's General Regulation V, and may be required to leave the University