Durham University
Programme and Module Handbook

Undergraduate Programme and Module Handbook 2016-2017 (archived)

Module ENGI4131: MICROELECTRONICS

Department: Engineering

ENGI4131: MICROELECTRONICS

Type Tied Level 4 Credits 20 Availability Available in 2016/17 Module Cap Location Durham
Tied to H100

Prerequisites

  • ENGI3331

Corequisites

  • As specified in programme regulations

Excluded Combination of Modules

  • As specified in programme regulations

Aims

  • This module is designed solely for students studying School of Engineering and Computing Sciences degree programmes.
  • The module will provide graduates with advanced knowledge and understanding of Nanoelectronic and Photonic Devices, and CAD for ICs and MEMs.

Content

  • Top-down versus bottom-up approaches to nanotechnology. Nanoelectronics.
  • Limitations of laws of physics – thermodynamics and quantum mechanics. Evolution of electronics. Moore’s laws.
  • Scaling laws for MOS devices.
  • Quantum limit. Power dissipation limit. Material and device limitations.
  • Pattern generation. Diffraction-limited optics. Minimum feature size and depth of focus.
  • Phase shifting masks.Immersion lithography. E-beam, ion-bean and X-ray lithography.
  • Microcontact printing.
  • Emerging devices. FinFET and UTB devices. Coulomb blockade. Single electron transistors.
  • Use of organic materials in electronics. Silicon versus polymers. Organic diodes, transistors and displays.
  • Electronics at the molecular level. Molecular diodes and transistors.
  • Molecular films: Self assembly (chemical and electrostatic).
  • LB film deposition.
  • Photonic crystals: Fundamental properties of photonic crystals.
  • Photonic devices: Photoconduction and operation of semiconductor photodiodes/lasers and solar cells.
  • Mixed Signal Integrated Circuit applications for Audio and Video. Modelling of electronic circuits using SPICE, and the types of analysis available by simulation including a Lab exercise. Development of a SPICE model for a given circuit and simulation of the circuit to investigate its properties. Simulation will include "What If" experiments to determine e.g. sensitivity to component value.
  • Integrated MEMS Applications: for micro sensors and Transducers taking account of the special mechanical design considerations associated with MEMS devices such as the accelerometer and Digital Mirror Device. Development of a simulation based on the modelling package COMSOL, and comparison with real device data.

Learning Outcomes

Subject-specific Knowledge:
  • An awareness of the state-of-the-art of microelectronic devices.
  • An understanding of the scope for further developments and an appreciation of the possible exploitation of nanoelectronics and photonics technologies (improved materials, processing and manipulation) for the realisation of new device architectures.
Subject-specific Skills:
  • An awareness of current technology and industrial practices along with the ability to apply those methods in novel situations.
  • An in-depth knowledge and understanding of specialised and advanced technical and professional skills, an ability to perform critical assessment and review and an ability to communicate the results of their own work effectively.
Key Skills:
  • Capacity for independent self-learning within the bounds of professional practice.
  • Highly specialised analysis skills appropriate to an engineer.
  • Mathematics relevant to the application of advanced engineering concepts.

Modes of Teaching, Learning and Assessment and how these contribute to the learning outcomes of the module

  • The components for CAD for ICs and MEMs are covered in lectures, practical laboratories and are reinforced by direct reading and problem solving activities involving continuous assessment and laboratory exercises. This course comprises two sections: Mixed Signal Integrated Circuit applications for Audio and Video, and Integrated MEMS applications. Each component will be assessed by continual assessment.
  • The courses in Nanoelectronics and Photonics are assessed by written timed examinations.
  • Students are able to make use of staff 'Tutorial Hours' to discuss any aspect of the module with teaching staff on a one-to-one basis. These are sign up sessions available for up to one hour per week.
  • Written timed examinations are appropriate because of the wide range of analytical, in-depth material covered in this module and to demonstrate the ability to solve advanced problems independently.

Teaching Methods and Learning Hours

Activity Number Frequency Duration Total/Hours
CAD for ICs Workshop 7 Typically 1 per week 3 Hour 21
CAD for MEMs Workshop 6 Typically 1 per week 3 Hour 18
Nanoelectronics & Photonics Lectures 20 Typically 1 per week 1 Hour 20
Tutorials Hours As required Weekly sign-up sessions up to 1 hour 8
Preparation, Reading and work on continual assessment outside workshop sessions 133
Total 200

Summative Assessment

Component: Examination Component Weighting: 50%
Element Length / duration Element Weighting Resit Opportunity
Microelectronics (Nanoelectronics & Photonics) 2 hours 100% No
Component: Continuous Assessment Component Weighting: 50%
Element Length / duration Element Weighting Resit Opportunity
CAD for ICs 50% No
CAD for MEMS 50% No

Formative Assessment:

None


Attendance at all activities marked with this symbol will be monitored. Students who fail to attend these activities, or to complete the summative or formative assessment specified above, will be subject to the procedures defined in the University's General Regulation V, and may be required to leave the University